NEW POLYMERIC MATERIALS FOR DESIGNING PHOTORESISTORS AND PHOTODETECTIVE
ASSEMBLIES BASED ON CdHgTe

L.M. Khitrova, Y.S. Troshkin, V.P. Belyaev, G.E. Popovyan, L.V. Kiseleva
State Unitary Enterprise "RD&P Center "Orion", Moscow, Russia

ABSTRACT

       In order to improve quality of photodetectors and photodetective two new cryo- and chemically resistant adhesives were developed after ђ’M 3-1950-91 standard: epoxy-silico-organic adhesive "”X-5P" and acrylic "ЋаЁ®­-2" adhesive for glueing of CdHgTe wafers to a substrate. "XCK-H" vacuum-tight modified adhesive is used for attacting of inlet windows and glass holder elements. "ЋаЁ®­-65" vibration damping thixotropic composition was developed for mounting of milti-layer printed curcuits.