In order to improve quality of photodetectors and photodetective two new cryo- and chemically resistant adhesives were developed after ђ’M 3-1950-91 standard: epoxy-silico-organic adhesive "”X-5P" and acrylic "ЋаЁ®-2" adhesive for glueing of CdHgTe wafers to a substrate. "XCK-H" vacuum-tight modified adhesive is used for attacting of inlet windows and glass holder elements. "ЋаЁ®-65" vibration damping thixotropic composition was developed for mounting of milti-layer printed curcuits.